Common Causes

During reflow soldering, PCB bending may be caused by rapid temperature change, uneven support, board thickness, component layout, panel size or insufficient fixture rigidity.

Fixture Design Considerations

  • Support thin boards and flexible circuits at critical points.
  • Review openings, pockets and ribs to avoid weak fixture areas.
  • Use low thermal-conductivity composite materials where heat transfer must be controlled.
  • Confirm flatness after repeated thermal cycles.
  • Keep approved drawings and inspection records for repeat orders.

Material Role

High-temperature synthetic stone can maintain mechanical performance during soldering cycles and can be machined into support carriers that reduce handling and thermal deformation risks.